BZV55-C2V4,115 vs BZV55C2V4 feature comparison

BZV55-C2V4,115 NXP Semiconductors

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BZV55C2V4 Excel (Suzhou) Semiconductor Co Ltd

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Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS EXCEL (SUZHOU) SEMICONDUCTOR CO LTD
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
Dynamic Impedance-Max 100 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 2.4 V
Reverse Current-Max 50 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 2 29

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