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BZV55-C18/T3 vs BZV55C18T1 feature comparison

BZV55-C18/T3 NXP Semiconductors

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BZV55C18T1 Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description O-LELF-R2 O-LELF-N2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 17.95 V
Reverse Current-Max 0.05 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Voltage Temp Coeff-Max 16 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 1 2
Part Package Code DO-34
Manufacturer Package Code CASE 362-03
Diodes » Zener Diodes
Diodes » Zener Diodes

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