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BZV55-C15,115 vs BZV55C15T2 feature comparison

BZV55-C15,115 NXP Semiconductors

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BZV55C15T2 Motorola Semiconductor Products

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code MELF
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LELF-N2
Pin Count 2
Manufacturer Package Code SOD80C
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
Dynamic Impedance-Max 30 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 14.7 V
Reverse Current-Max 0.05 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max 13 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 2 2
Diodes » Zener Diodes
Diodes » Zener Diodes

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