BZV55C15T2
vs
BZV55-C15,135
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
O-LELF-N2
O-LELF-R2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Base Number Matches
2
2
Rohs Code
Part Package Code
MELF
Pin Count
2
Manufacturer Package Code
SOD80C
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
Dynamic Impedance-Max
30 Ω
JESD-30 Code
O-LELF-R2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
Qualification Status
Not Qualified
Reference Voltage-Nom
14.7 V
Reverse Current-Max
0.05 µA
Surface Mount
YES
Technology
ZENER
Terminal Finish
TIN
Terminal Form
WRAP AROUND
Terminal Position
END
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
13 mV/°C
Voltage Tol-Max
5%
Working Test Current
5 mA
Compare BZV55C15T2 with alternatives
Compare BZV55-C15,135 with alternatives