BZV55-B3V6
vs
MSP1N5227BTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GENERAL INSTRUMENT CORP
MICROSEMI CORP
Reach Compliance Code
unknown
unknown
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LALF-W2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.417 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WIRE
Terminal Position
END
AXIAL
Voltage Tol-Max
2%
5%
Working Test Current
5 mA
20 mA
Base Number Matches
7
1
Rohs Code
Part Package Code
DO-7
Package Description
HERMETIC SEALED, GLASS, DO-7, 2 PIN
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
JEDEC-95 Code
DO-204AA
JESD-609 Code
e0
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Terminal Finish
TIN LEAD
Compare BZV55-B3V6 with alternatives
Compare MSP1N5227BTR with alternatives