BZV55-B2V7,115
vs
BZV55-B2V7
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Part Package Code |
MELF
|
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD80C
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Factory Lead Time |
4 Weeks
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
|
Dynamic Impedance-Max |
100 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
200 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
0.4 W
|
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
2.7 V
|
|
Reverse Current-Max |
20 µA
|
|
Surface Mount |
YES
|
|
Technology |
ZENER
|
|
Terminal Finish |
TIN
|
|
Terminal Form |
WRAP AROUND
|
|
Terminal Position |
END
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Temp Coeff-Max |
|
|
Voltage Tol-Max |
2%
|
|
Working Test Current |
5 mA
|
|
Base Number Matches |
1
|
|
|
|
|
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