BZT52H-C3V6/DG
vs
BZT52H-C3V6,115
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
PLASTIC PACKAGE-2
|
PLASTIC PACKAGE-2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.375 W
|
0.375 W
|
Reference Voltage-Nom |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Tol-Max |
5.56%
|
5.56%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOD-123
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
SOD123F
|
Factory Lead Time |
|
4 Weeks
|
Dynamic Impedance-Max |
|
500 Ω
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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Compare BZT52H-C3V6,115 with alternatives
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