BZT52C10 vs BZV55C10 feature comparison

BZT52C10 Diodes Incorporated

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BZV55C10 Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer DIODES INC MICROCHIP TECHNOLOGY INC
Package Description PLASTIC PACKAGE-2 HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 20 Ω
JESD-30 Code R-PDSO-G2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape RECTANGULAR ROUND
Package Style SMALL OUTLINE LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 10 V 10 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING WRAP AROUND
Terminal Position DUAL END
Voltage Tol-Max 6% 6%
Working Test Current 5 mA 5 mA
Base Number Matches 23 1
Factory Lead Time 14 Weeks
Samacsys Manufacturer Microchip
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
JEDEC-95 Code DO-213AA
Qualification Status Not Qualified

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