BYW93-50U
vs
1N3909E3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
MICROSEMI CORP
|
| Package Description |
O-MUPM-D1
|
DO-5, 1PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
ULTRA FAST SOFT RECOVERY
|
FAST RECOVERY
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.3 V
|
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
1000 A
|
300 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
60 A
|
50 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
|
| Reference Standard |
CECC50009-028
|
|
| Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
| Reverse Current-Max |
250 µA
|
|
| Reverse Recovery Time-Max |
0.045 µs
|
0.2 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
1
|
| JEDEC-95 Code |
|
DO-203AB
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare BYW93-50U with alternatives
Compare 1N3909E3 with alternatives