BYV29-500,127
vs
MUR860
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
TO-220
|
|
| Package Description |
PLASTIC PACKAGE-2
|
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD59
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Factory Lead Time |
4 Weeks
|
|
| Application |
ULTRA FAST SOFT RECOVERY
|
|
| Case Connection |
CATHODE
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.4 V
|
1.5 V
|
| JEDEC-95 Code |
TO-220AC
|
|
| JESD-30 Code |
R-PSFM-T2
|
|
| JESD-609 Code |
e3
|
e0
|
| Non-rep Pk Forward Current-Max |
110 A
|
100 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Output Current-Max |
9 A
|
8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLANGE MOUNT
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
500 V
|
600 V
|
| Reverse Recovery Time-Max |
0.06 µs
|
0.06 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
SINGLE
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
27
|
|
|
|
Compare BYV29-500,127 with alternatives
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BYV29-500,127 vs BYV29-500
-
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-
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-
BYV29-500,127 vs MUR860P
-
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-
BYV29-500,127 vs BYV29X-600,127
-
BYV29-500,127 vs BYR29-500
-
BYV29-500,127 vs BYV29X-600