BWCS0023171539NK00
vs
FHW0805UC039KGB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
CHILISIN ELECTRONICS CORP
|
FENGHUA ADVANCED TECHNOLOGY
|
| Package Description |
CHIP
|
0805
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Case/Size Code |
0805
|
0805
|
| Construction |
Rectangular
|
Wirewound Chip
|
| Core Material |
CERAMIC
|
CERAMIC
|
| DC Resistance |
0.29 Ω
|
0.29 Ω
|
| Inductance-Nom (L) |
0.039 µH
|
0.039 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Height |
1.52 mm
|
1.52 mm
|
| Package Length |
2.35 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.73 mm
|
1.2 mm
|
| Packing Method |
TR, Paper, 7 Inch
|
Bulk
|
| Quality Factor-Min (at L-nom) |
60
|
55
|
| Rated Current-Max |
0.5 A
|
0.5 A
|
| Self Resonance Frequency |
2000 MHz
|
2000 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
ONE SURFACE
|
WRAPAROUND
|
| Test Frequency |
250 MHz
|
250 MHz
|
| Tolerance |
10%
|
10%
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| Special Feature |
|
Q MEASURED AT 500 MHZ
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare BWCS0023171539NK00 with alternatives
Compare FHW0805UC039KGB with alternatives