BUR50S vs BUW39 feature comparison

BUR50S TT Electronics Power and Hybrid / Semelab Limited

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BUW39 STMicroelectronics

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SEMELAB LTD STMICROELECTRONICS
Part Package Code BFM
Package Description FLANGE MOUNT, O-MBFM-P2
Pin Count 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 70 A 30 A
Collector-Emitter Voltage-Max 125 V 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 20
JEDEC-95 Code TO-204AE TO-3
JESD-30 Code O-MBFM-P2 O-MBFM-P2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 16 MHz 8 MHz
Base Number Matches 4 1
HTS Code 8541.29.00.95
JESD-609 Code e0
Operating Temperature-Max 200 °C
Power Dissipation Ambient-Max 150 W
Power Dissipation-Max (Abs) 150 W
Terminal Finish TIN LEAD
Transistor Application SWITCHING
Turn-off Time-Max (toff) 1350 ns
Turn-on Time-Max (ton) 1200 ns
VCEsat-Max 1.2 V

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