BUW39 vs BUR50 feature comparison

BUW39 TT Electronics Power and Hybrid / Semelab Limited

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BUR50 STMicroelectronics

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer SEMELAB LTD STMICROELECTRONICS
Part Package Code BFM
Package Description FLANGE MOUNT, O-MBFM-P2
Pin Count 2
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 30 A 70 A
Collector-Emitter Voltage-Max 80 V 125 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 20 15
JEDEC-95 Code TO-204AE TO-3
JESD-30 Code O-MBFM-P2 O-MBFM-P2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 8 MHz 16 MHz
Base Number Matches 4 4
HTS Code 8541.29.00.95
JESD-609 Code e0
Operating Temperature-Max 200 °C
Power Dissipation Ambient-Max 350 W
Power Dissipation-Max (Abs) 350 W
Terminal Finish TIN LEAD
Transistor Application SWITCHING
Turn-off Time-Max (toff) 2500 ns
Turn-on Time-Max (ton) 1200 ns
VCEsat-Max 1.5 V

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