BUK763R1-40B,118 vs PHB225NQ04T feature comparison

BUK763R1-40B,118 Nexperia

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PHB225NQ04T NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code D2PAK
Package Description PLASTIC, D2PAK-3 PLASTIC, D2PAK-3
Pin Count 3 3
Manufacturer Package Code SOT404
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
Samacsys Manufacturer Nexperia
Avalanche Energy Rating (Eas) 1600 mJ 560 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 40 V 40 V
Drain Current-Max (ID) 75 A 75 A
Drain-source On Resistance-Max 0.0031 Ω 0.0031 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PSSO-G2 R-PSSO-G2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C 175 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 245 245
Polarity/Channel Type N-CHANNEL N-CHANNEL
Pulsed Drain Current-Max (IDM) 902 A 240 A
Qualification Status Not Qualified Not Qualified
Reference Standard AEC-Q101
Surface Mount YES YES
Terminal Finish TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Power Dissipation-Max (Abs) 300 W

Compare BUK763R1-40B,118 with alternatives

Compare PHB225NQ04T with alternatives