BU8242F-T2
vs
U2763B-AFN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROHM CO LTD
ATMEL CORP
Part Package Code
SOIC
SOIC
Package Description
SOP-20
SSOP, SSOP20,.25
Pin Count
20
20
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e3/e2
e0
Length
12.5 mm
6.625 mm
Number of Functions
1
1
Number of Terminals
20
20
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.01 mm
Surface Mount
YES
YES
Telecom IC Type
SUPPORT CIRCUIT
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Terminal Finish
TIN/TIN COPPER
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
10
Width
5.4 mm
4.4 mm
Base Number Matches
1
3
HTS Code
8542.39.00.01
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
SSOP20,.25
Supply Voltage-Nom
2.9 V
Technology
BIPOLAR
Temperature Grade
COMMERCIAL
Compare BU8242F-T2 with alternatives
Compare U2763B-AFN with alternatives