BU8242F-T2
vs
TG2403CT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP-20
|
HVBCC,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDSO-G20
|
R-XBCC-B20
|
| JESD-609 Code |
e3/e2
|
|
| Length |
12.5 mm
|
3.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVBCC
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.01 mm
|
0.53 mm
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Terminal Finish |
TIN/TIN COPPER
|
|
| Terminal Form |
GULL WING
|
BUTT
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
NOT SPECIFIED
|
| Width |
5.4 mm
|
2.9 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Supply Current-Max |
|
180 mA
|
| Supply Voltage-Nom |
|
3 V
|
| Technology |
|
GAAS
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare BU8242F-T2 with alternatives
Compare TG2403CT with alternatives