BU4094BCF
vs
GD74HCT322
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
GOLDSTAR ELECTRON CO LTD
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.25
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
COMPLIMENTARY SERIAL OUTPUT ALSO AVAILABLE
|
|
| Count Direction |
RIGHT
|
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T20
|
| JESD-609 Code |
e2
|
|
| Length |
10 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
SERIAL IN PARALLEL OUT
|
PARALLEL IN PARALLEL OUT
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
840 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.71 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
4.4 mm
|
|
| fmax-Min |
3 MHz
|
|
| Base Number Matches |
10
|
3
|
|
|
|
Compare BU4094BCF with alternatives
Compare GD74HCT322 with alternatives