BU4001BF vs 933507890652 feature comparison

BU4001BF ROHM Semiconductor

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933507890652 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description LSOP, SOP14,.25 SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e4
Length 8.7 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 90 ns 130 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.6 mm 1.75 mm
Supply Voltage-Max (Vsup) 16 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Copper (Sn/Cu) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 3.9 mm
Base Number Matches 9 1

Compare BU4001BF with alternatives

Compare 933507890652 with alternatives