BU2708DX vs MJE13071-DR6280 feature comparison

BU2708DX NXP Semiconductors

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MJE13071-DR6280 Intersil Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SOT
Package Description FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Pin Count 3
Manufacturer Package Code SOT399
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Case Connection ISOLATED COLLECTOR
Collector Current-Max (IC) 8 A 5 A
Collector-Emitter Voltage-Max 825 V 450 V
Configuration SINGLE WITH BUILT-IN DIODE AND RESISTOR SINGLE
DC Current Gain-Min (hFE) 3 8
JESD-30 Code R-PSFM-T3 R-PSFM-T3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation Ambient-Max 45 W 80 W
Power Dissipation-Max (Abs) 45 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 6020 ns 2000 ns
VCEsat-Max 1 V 3 V
Base Number Matches 1 1
Collector-Base Capacitance-Max 250 pF
JEDEC-95 Code TO-220AB
Turn-on Time-Max (ton) 450 ns

Compare BU2708DX with alternatives

Compare MJE13071-DR6280 with alternatives