BU-63825G0-120
vs
BU-63825D0-470
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
DATA DEVICE CORP
|
DATA DEVICE CORP
|
| Package Description |
SOP, SOP70,1.4
|
QIP, QUIP70B,.4/.6
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
LG-MAX, WD-MAX
|
LG-MAX, WD-MAX
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| Communication Protocol |
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
|
| Data Encoding/Decoding Method |
BIPH-LEVEL(MANCHESTER)
|
BIPH-LEVEL(MANCHESTER)
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
R-CDSO-G70
|
R-CQIP-P70
|
| Length |
48.26 mm
|
48.26 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
70
|
70
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QIP
|
| Package Equivalence Code |
SOP70,1.4
|
QUIP70B,.4/.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Seated Height-Max |
5.461 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
25.4 mm
|
25.4 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare BU-63825G0-120 with alternatives
Compare BU-63825D0-470 with alternatives