BU-63825D0-470
vs
BU-63825F0-401W
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
DATA DEVICE CORP
DATA DEVICE CORP
Package Description
QIP, QUIP70B,.4/.6
DFP,
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
LG-MAX, WD-MAX
LG-MAX, WD-MAX
Address Bus Width
16
16
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
16 MHz
Communication Protocol
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
Data Encoding/Decoding Method
BIPH-LEVEL(MANCHESTER)
BIPH-LEVEL(MANCHESTER)
Data Transfer Rate-Max
0.125 MBps
0.125 MBps
External Data Bus Width
16
16
JESD-30 Code
R-CQIP-P70
R-CDFP-F70
JESD-609 Code
e0
Length
48.26 mm
48.26 mm
Low Power Mode
YES
YES
Number of Serial I/Os
2
Number of Terminals
70
70
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QIP
DFP
Package Equivalence Code
QUIP70B,.4/.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
25.4 mm
25.4 mm
uPs/uCs/Peripheral ICs Type
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches
1
1
Seated Height-Max
5.46 mm
Compare BU-63825D0-470 with alternatives
Compare BU-63825F0-401W with alternatives