BT258X-500R vs MCR12NG feature comparison

BT258X-500R NXP Semiconductors

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MCR12NG onsemi

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code SFM TO-220AB
Package Description FLANGE MOUNT, R-PSFM-T3 CASE 221A-09, 3 PIN
Pin Count 3 3
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.30.00.80 8541.30.00.80
Additional Feature SENSITIVE GATE
Case Connection ISOLATED ANODE
Circuit Commutated Turn-off Time-Nom 100 µs
Configuration SINGLE SINGLE
Critical Rate of Rise of Off-State Voltage-Min 50 V/us 100 V/us
DC Gate Trigger Current-Max 0.2 mA 20 mA
DC Gate Trigger Voltage-Max 1.5 V 1 V
Holding Current-Max 6 mA 40 mA
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e3 e3
Leakage Current-Max 0.5 mA 2 mA
Non-Repetitive Pk On-state Cur 75 A 100 A
Number of Elements 1 1
Number of Terminals 3 3
On-state Current-Max 5000 A 12000 A
Operating Temperature-Max 125 °C 125 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Qualification Status Not Qualified Not Qualified
RMS On-state Current-Max 8 A 12 A
Repetitive Peak Off-state Leakage Current-Max 500 µA
Repetitive Peak Off-state Voltage 500 V 800 V
Repetitive Peak Reverse Voltage 500 V 800 V
Surface Mount NO NO
Terminal Finish TIN Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Trigger Device Type SCR SCR
Base Number Matches 3 2
Manufacturer Package Code 221A-09
JEDEC-95 Code TO-220AB
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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