BSP33-T vs MJD32 feature comparison

BSP33-T NXP Semiconductors

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MJD32 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SAMSUNG SEMICONDUCTOR INC
Part Package Code SC-73
Package Description SMALL OUTLINE, R-PDSO-G4 ,
Pin Count 4
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection COLLECTOR
Collector Current-Max (IC) 1 A 3 A
Collector-Base Capacitance-Max 20 pF
Collector-Emitter Voltage-Max 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 50 10
JESD-30 Code R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4
Operating Temperature-Max 150 °C 140 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified
Surface Mount YES YES
Terminal Form GULL WING
Terminal Position DUAL
Transistor Element Material SILICON
Transition Frequency-Nom (fT) 100 MHz 3 MHz
Turn-off Time-Max (toff) 650 ns
Turn-on Time-Max (ton) 500 ns
VCEsat-Max 0.5 V
Base Number Matches 1 6
Rohs Code No
JESD-609 Code e0
Power Dissipation-Max (Abs) 15 W
Terminal Finish Tin/Lead (Sn/Pb)

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