BSP126,115
vs
934000540115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SC-73
Package Description
PLASTIC, SMD, SC-73, 4 PIN
SMALL OUTLINE, R-PDSO-G4
Pin Count
4
Manufacturer Package Code
SOT223
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Case Connection
DRAIN
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
250 V
250 V
Drain Current-Max (ID)
0.375 A
0.375 A
Drain-source On Resistance-Max
5 Ω
5 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss)
15 pF
15 pF
JESD-30 Code
R-PDSO-G4
R-PDSO-G4
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
4
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
1.5 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Reference Standard
IEC-60134
Compare BSP126,115 with alternatives
Compare 934000540115 with alternatives