BS62LV8001FIP70
vs
CY14B108L-BA45XIT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
BRILLIANCE SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA48,6X8,30
FBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
45 ns
I/O Type
COMMON
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
12 mm
10 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.0000013 A
0.01 A
Standby Voltage-Min
1.5 V
Supply Current-Max
0.061 mA
0.057 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
6 mm
Base Number Matches
1
1
JESD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
20
Compare BS62LV8001FIP70 with alternatives
Compare CY14B108L-BA45XIT with alternatives