BS616LV2019TAG70
vs
UPD442012AGY-BC10X-MJH-A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
BRILLIANCE SEMICONDUCTOR INC
|
NEC ELECTRONICS CORP
|
| Part Package Code |
TSOP1
|
TSOP1
|
| Package Description |
TSOP1,
|
TSOP1,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 ns
|
100 ns
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Length |
16.4 mm
|
18 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
TSOP1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
11.8 mm
|
12 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e6
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN BISMUTH
|
|
|
|
Compare BS616LV2019TAG70 with alternatives
Compare UPD442012AGY-BC10X-MJH-A with alternatives