BR24T128-W vs XC17S150APD8I feature comparison

BR24T128-W ROHM Semiconductor

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XC17S150APD8I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD XILINX INC
Package Description DIP, DIP8,.3 PLASTIC, DIP-8
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.61
Samacsys Manufacturer ROHM Semiconductor
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e0
Memory Density 131072 bit 1040096 bit
Memory IC Type EEPROM CONFIGURATION MEMORY
Memory Width 8 1
Moisture Sensitivity Level 1 1
Number of Terminals 8 8
Number of Words 16384 words 1040096 words
Number of Words Code 16000 1040096
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX8 1040096X1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Serial Bus Type I2C
Standby Current-Max 0.000002 A 0.00005 A
Supply Current-Max 0.0025 mA 0.005 mA
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn85Pb15)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Write Protection HARDWARE
Base Number Matches 3 1
Part Package Code DIP
Pin Count 8
I/O Type COMMON
Length 9.3599 mm
Number of Functions 1
Operating Mode SYNCHRONOUS
Output Characteristics 3-STATE
Seated Height-Max 4.5974 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Width 7.62 mm

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Compare XC17S150APD8I with alternatives