XC17S150APD8I vs BR24T32-WG feature comparison

XC17S150APD8I AMD Xilinx

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BR24T32-WG ROHM Semiconductor

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ROHM CO LTD
Part Package Code DIP DIP
Package Description PLASTIC, DIP-8 HALOGEN FREE AND ROHS COMPLIANT, DIP-8
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.51
I/O Type COMMON
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 9.3599 mm 9.3 mm
Memory Density 1040096 bit 32768 bit
Memory IC Type CONFIGURATION MEMORY EEPROM
Memory Width 1 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1040096 words 4096 words
Number of Words Code 1040096 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1040096X1 4KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225 NOT SPECIFIED
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 4.21 mm
Standby Current-Max 0.00005 A 0.000002 A
Supply Current-Max 0.01 mA 0.002 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 1.7 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature SEATED HT-CALCULATED
Clock Frequency-Max (fCLK) 0.4 MHz
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010DDDR
Serial Bus Type MICROWIRE
Write Cycle Time-Max (tWC) 5 ms
Write Protection HARDWARE

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