BR24C16-WDS6TP vs 11LC160T-I/MN feature comparison

BR24C16-WDS6TP ROHM Semiconductor

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11LC160T-I/MN Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD MICROCHIP TECHNOLOGY INC
Part Package Code TSSOP DFN
Package Description TSSOP, TSSOP8,.19 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
kg CO2e/kg 12
Average Weight (mg) 40.65
CO2e (mg) 487.8
Category CO2 Kg 12 12
Compliance Temperature Grade Industrial: -40C to +85C Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2011/65/EU) RoHS 2 (2015/863/EU)
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V6.10 CMRT V6.22
Clock Frequency-Max (fCLK) 0.4 MHz 1 MHz
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010MMMR
JESD-30 Code S-PDSO-G8 R-PDSO-N8
Length 3 mm 3 mm
Memory Density 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16384 words 2048 words
Number of Words Code 16000 2000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16KX1 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVSON
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.8 mm
Serial Bus Type I2C 1-WIRE
Standby Current-Max 5e-7 A
Supply Current-Max 0.001 mA 0.005 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 3 mm 2 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Write Protection HARDWARE
Base Number Matches 1 1
Candidate List Date 2024-01-23
EFUP e
Qualifications AEC-Q100
JESD-609 Code e4
Moisture Sensitivity Level 1
Screening Level AEC-Q100
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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