BQ77PL900DL
vs
BQ77910DBT
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SSOP
|
TSSOP
|
Package Description |
SSOP-48
|
TSSOP, TSSOP38,.25,20
|
Pin Count |
48
|
38
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
Input Voltage-Max |
50 V
|
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G38
|
JESD-609 Code |
e4
|
e4
|
Length |
15.875 mm
|
9.7 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of Channels |
10
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
38
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
TSSOP
|
Package Equivalence Code |
SSOP48,.4
|
TSSOP38,.25,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.79 mm
|
1.2 mm
|
Supply Current-Max (Isup) |
0.8 mA
|
0.075 mA
|
Supply Voltage-Max (Vsup) |
50 V
|
43.75 V
|
Supply Voltage-Min (Vsup) |
7 V
|
5.6 V
|
Supply Voltage-Nom (Vsup) |
36 V
|
36 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7.49 mm
|
4.4 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare BQ77PL900DL with alternatives
Compare BQ77910DBT with alternatives