BQ51013YFFR
vs
BQ51010BYFPR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
End Of Life
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
Package Description
DSBGA-28
DSBGA-28
Pin Count
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
JESD-30 Code
R-XBGA-B28
R-XBGA-B28
JESD-609 Code
e1
e1
Length
2.76 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
0.625 mm
0.5 mm
Supply Voltage-Nom
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.56 mm
1.88 mm
Base Number Matches
1
1
Compare BQ51013YFFR with alternatives
Compare BQ51010BYFPR with alternatives