BQ24250YFFR
vs
BQ24250RGER
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
Input Voltage-Max |
10.5 V
|
10.5 V
|
Input Voltage-Min |
4.35 V
|
4.35 V
|
JESD-30 Code |
R-XBGA-B30
|
S-PQCC-N24
|
JESD-609 Code |
e1
|
e4
|
Length |
2.2 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
30
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA30,5X6,16
|
LCC24,.16SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.375 mm
|
0.88 mm
|
Supply Current-Max (Isup) |
5 mA
|
5 mA
|
Supply Voltage-Max (Vsup) |
10.5 V
|
10.5 V
|
Supply Voltage-Min (Vsup) |
4.35 V
|
4.35 V
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Threshold Voltage-Nom |
+3.35V
|
+3.35V
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.59 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare BQ24250YFFR with alternatives
Compare BQ24250RGER with alternatives