BQ24156AYFFR
vs
UCS2112-1-V/G4
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
DSBGA-20
|
HVQCCN,
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
Input Voltage-Max |
9 V
|
|
Input Voltage-Min |
4 V
|
|
JESD-30 Code |
R-XBGA-B20
|
S-PQCC-N20
|
JESD-609 Code |
e1
|
e3
|
Length |
2.14 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
1
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA20,4X5,16
|
LCC20,.16SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.625 mm
|
0.9 mm
|
Supply Voltage-Max (Vsup) |
9 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
2 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare BQ24156AYFFR with alternatives
Compare UCS2112-1-V/G4 with alternatives