BLV59 vs BLW34 feature comparison

BLV59 Advanced Semiconductor Inc

Buy Now Datasheet

BLW34 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ASI SEMICONDUCTOR INC NXP SEMICONDUCTORS
Package Description FLANGE MOUNT, R-CDFM-F6 POST/STUD MOUNT, O-CRPM-F4
Pin Count 6 4
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 10 A 2.25 A
Collector-Emitter Voltage-Max 25 V 30 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 15 20
JESD-30 Code R-CDFM-F6 O-CRPM-F4
Number of Elements 1 1
Number of Terminals 6 4
Operating Temperature-Max 200 °C 200 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT POST/STUD MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 70 W 31 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES NO
Terminal Form FLAT FLAT
Terminal Position DUAL RADIAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 2
Part Package Code SOT
Manufacturer Package Code SOT122A
HTS Code 8541.29.00.75
Additional Feature HIGH RELIABILITY, DIFFUSED EMITTER BALLASTING RESISTORS
Highest Frequency Band ULTRA HIGH FREQUENCY BAND
Power Dissipation Ambient-Max 31 W
Power Gain-Min (Gp) 9 dB
Transition Frequency-Nom (fT) 3300 MHz

Compare BLV59 with alternatives

Compare BLW34 with alternatives