BLV103
vs
MRF891S
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SOT
Package Description
FLANGE MOUNT, R-CDFM-F6
Pin Count
6
Manufacturer Package Code
SOT171A
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
8541.29.00.75
Additional Feature
HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS
Case Connection
ISOLATED
Collector Current-Max (IC)
1.25 A
0.6 A
Collector-Base Capacitance-Max
8 pF
8 pF
Collector-Emitter Voltage-Max
30 V
30 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
20
30
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
ULTRA HIGH FREQUENCY BAND
JESD-30 Code
R-CDFM-F6
R-CDMW-F6
Number of Elements
1
1
Number of Terminals
6
6
Operating Temperature-Max
200 °C
150 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
MICROWAVE
Polarity/Channel Type
NPN
NPN
Power Dissipation Ambient-Max
17 W
18 W
Power Dissipation-Max (Abs)
17 W
18 W
Power Gain-Min (Gp)
11.5 dB
9 dB
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Compare BLV103 with alternatives
Compare MRF891S with alternatives