BLU0603A-1103-BB50 vs RP73G1J110KBTDG feature comparison

BLU0603A-1103-BB50 RCD Components Inc

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RP73G1J110KBTDG TE Connectivity

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer RCD COMPONENTS INC TE CONNECTIVITY LTD
Reach Compliance Code compliant unknown
ECCN Code EAR99
Construction Chip Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.55 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method Bulk TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 110000 Ω 110000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Tolerance 0.1% 0.1%
Working Voltage 75 V 75 V
Base Number Matches 1 1
Rohs Code Yes
Package Description CHIP
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Reference Standard MIL-STD-202
Series RP73
Terminal Shape WRAPAROUND

Compare BLU0603A-1103-BB50 with alternatives

Compare RP73G1J110KBTDG with alternatives