BLF6G20-45,135
vs
934064344112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DFM
Package Description
ROHS COMPLIANT, CERAMIC PACKAGE-2
ROHS COMPLIANT, CERAMIC PACKAGE-4
Pin Count
2
Manufacturer Package Code
SOT608A
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.75
Total Weight
3913.7
Category CO2 Kg
8.9
8.9
CO2
34831.93
EU RoHS Version
RoHS 2 (2015/863/EU)
Candidate List Date
2020-01-16
CAS Accounted for Wt
99
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
7440-48-4, 7440-02-0
EFUP
e
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V3.01
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
COMMON SOURCE, 2 ELEMENTS
DS Breakdown Voltage-Min
65 V
65 V
Drain Current-Max (ID)
13 A
18 A
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
L BAND
L BAND
JESD-30 Code
R-CDFM-F2
R-CDFP-F4
Number of Elements
1
2
Number of Terminals
2
4
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
225 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
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