BFR30LT1
vs
BFR30,215
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
PLASTIC, SMD, SST3, 3 PIN
|
Reach Compliance Code |
unknown
|
compliant
|
FET Technology |
JUNCTION
|
JUNCTION
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
0.3 W
|
0.3 W
|
Surface Mount |
YES
|
YES
|
Base Number Matches |
4
|
1
|
Part Package Code |
|
TO-236
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT23
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.21.00.95
|
Samacsys Manufacturer |
|
NXP
|
Configuration |
|
SINGLE
|
DS Breakdown Voltage-Min |
|
25 V
|
Drain Current-Max (ID) |
|
0.01 A
|
Feedback Cap-Max (Crss) |
|
1.5 pF
|
JESD-30 Code |
|
R-PDSO-G3
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Operating Mode |
|
DEPLETION MODE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
AMPLIFIER
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare BFR30,215 with alternatives