BFR30,215
vs
BFR30LT1G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
TO-236
SOT-23
Package Description
PLASTIC, SMD, SST3, 3 PIN
LEAD FREE, CASE 318-08, 3 PIN
Pin Count
3
3
Manufacturer Package Code
SOT23
CASE 318-08
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.21.00.95
Samacsys Manufacturer
NXP
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
25 V
25 V
Drain Current-Max (ID)
0.01 A
FET Technology
JUNCTION
JUNCTION
Feedback Cap-Max (Crss)
1.5 pF
1.5 pF
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
NOT SPECIFIED
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
DEPLETION MODE
DEPLETION MODE
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
0.3 W
Qualification Status
Not Qualified
COMMERCIAL
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
2
Pbfree Code
JEDEC-95 Code
TO-236AB
Compare BFR30,215 with alternatives
Compare BFR30LT1G with alternatives