BF824W/T3
vs
BF824T/R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC PACKAGE-3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Date Of Intro
2017-02-01
Collector Current-Max (IC)
0.025 A
0.025 A
Collector-Emitter Voltage-Max
30 V
30 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
25
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
PNP
PNP
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
390 MHz
440 MHz
Base Number Matches
2
3
Part Package Code
SOT-23
Pin Count
3
Collector-Base Capacitance-Max
0.3 pF
JEDEC-95 Code
TO-236AB
Operating Temperature-Max
150 °C
Power Dissipation-Max (Abs)
0.3 W
Qualification Status
Not Qualified
Transistor Application
AMPLIFIER
Compare BF824W/T3 with alternatives
Compare BF824T/R with alternatives