BF510TRL13
vs
BF510,215
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
NXP SEMICONDUCTORS
Package Description
SMALL OUTLINE, R-PDSO-G3
PLASTIC, SMD, SST3, 3 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Configuration
SINGLE
SINGLE
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
1
Rohs Code
Part Package Code
TO-236
Pin Count
3
Manufacturer Package Code
SOT23
HTS Code
8541.21.00
Date Of Intro
1993-07-01
Samacsys Manufacturer
NXP
Additional Feature
LOW NOISE
DS Breakdown Voltage-Min
20 V
Drain Current-Max (ID)
0.03 A
FET Technology
JUNCTION
Feedback Cap-Max (Crss)
0.4 pF
Highest Frequency Band
VERY HIGH FREQUENCY BAND
JESD-609 Code
e3
Moisture Sensitivity Level
1
Operating Mode
DEPLETION MODE
Operating Temperature-Max
150 °C
Peak Reflow Temperature (Cel)
260
Polarity/Channel Type
N-CHANNEL
Power Dissipation-Max (Abs)
0.25 W
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare BF510TRL13 with alternatives
Compare BF510,215 with alternatives