BD42530FP2-CE2
vs
TMP513AIRSAR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TO-263,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
Texas Instruments
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
R-PSSO-G5
|
S-PQCC-N16
|
| Length |
10.16 mm
|
4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-263
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
4.95 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
42 V
|
26 V
|
| Supply Voltage-Min (Vsup) |
5.6 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
13.5 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.7 mm
|
0.65 mm
|
| Terminal Position |
SINGLE
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
9.15 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
2
|
| Number of Channels |
|
2
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max (Isup) |
|
1.4 mA
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare BD42530FP2-CE2 with alternatives
Compare TMP513AIRSAR with alternatives