BD139
vs
BD139
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
STMICROELECTRONICS
|
| Part Package Code |
TO-225AA
|
SIP
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
PLASTIC PACKAGE-3
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
CASE 77-08
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
8541.29.00.75
|
| Collector Current-Max (IC) |
1.5 A
|
1.5 A
|
| Collector-Emitter Voltage-Max |
80 V
|
80 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
25
|
25
|
| JEDEC-95 Code |
TO-225AA
|
TO-126
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation Ambient-Max |
12.5 W
|
12.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| VCEsat-Max |
0.5 V
|
0.5 V
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
14 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Case Connection |
|
ISOLATED
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power Dissipation-Max (Abs) |
|
8 W
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Transition Frequency-Nom (fT) |
|
250 MHz
|
|
|
|
Compare BD139 with alternatives
Compare BD139 with alternatives