BCV61-C
vs
BCV61
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SIEMENS A G
|
NXP SEMICONDUCTORS
|
| Package Description |
SMALL OUTLINE, R-PDSO-G4
|
PLASTIC PACKAGE-4
|
| Reach Compliance Code |
unknown
|
compliant
|
| Case Connection |
COLLECTOR
|
COLLECTOR
|
| Collector Current-Max (IC) |
0.2 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
30 V
|
30 V
|
| Configuration |
CURRENT MIRROR
|
COMMON BASE, 2 ELEMENTS
|
| DC Current Gain-Min (hFE) |
420
|
110
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
4
|
4
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
250 MHz
|
100 MHz
|
| VCEsat-Max |
0.6 V
|
0.6 V
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Pin Count |
|
4
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BCV61-C with alternatives
Compare BCV61 with alternatives