BCV61 vs BCV61B-E6433 feature comparison

BCV61 NXP Semiconductors

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BCV61B-E6433 Infineon Technologies AG

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS INFINEON TECHNOLOGIES AG
Package Description PLASTIC PACKAGE-4
Pin Count 4
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration COMMON BASE, 2 ELEMENTS CURRENT MIRROR
DC Current Gain-Min (hFE) 110 200
JESD-30 Code R-PDSO-G4 R-PDSO-G4
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 2 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 250 MHz
VCEsat-Max 0.6 V
Base Number Matches 5 2
Power Dissipation-Max (Abs) 0.3 W

Compare BCV61 with alternatives

Compare BCV61B-E6433 with alternatives