BCV26 vs BCV26,215 feature comparison

BCV26 Central Semiconductor Corp

Buy Now Datasheet

BCV26,215 NXP Semiconductors

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer CENTRAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Part Package Code SOT-23 TO-236
Package Description SOT-23, 3 PIN PLASTIC PACKAGE-3
Pin Count 3 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.5 A 0.5 A
Collector-Emitter Voltage-Max 30 V 30 V
Configuration DARLINGTON DARLINGTON
DC Current Gain-Min (hFE) 20000 20000
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Power Dissipation-Max (Abs) 0.3 W 0.3 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 220 MHz 220 MHz
Base Number Matches 5 1
Manufacturer Package Code SOT23
HTS Code 8541.21.00.75
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JEDEC-95 Code TO-236AB
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application AMPLIFIER
VCEsat-Max 1 V

Compare BCV26 with alternatives

Compare BCV26,215 with alternatives