BCP52TRL vs BSP33,115 feature comparison

BCP52TRL NXP Semiconductors

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BSP33,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PDSO-G4 SMALL OUTLINE, R-PDSO-G4
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 1 A 1 A
Collector-Emitter Voltage-Max 60 V 80 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 40 50
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Number of Elements 1 1
Number of Terminals 4 4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type PNP PNP
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 50 MHz 100 MHz
VCEsat-Max 0.5 V 0.5 V
Base Number Matches 2 1
Rohs Code Yes
Part Package Code SC-73
Pin Count 4
Manufacturer Package Code SOT223
HTS Code 8541.29.00.75
Case Connection COLLECTOR
Collector-Base Capacitance-Max 20 pF
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max (Abs) 1.5 W
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Turn-off Time-Max (toff) 650 ns
Turn-on Time-Max (ton) 500 ns

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