BCM5400
vs
VSC8552XKS-04
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
BROADCOM CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
TBGA-256
|
BGA-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
X-PBGA-B256
|
S-PBGA-B256
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
2.5 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
5A991.B.1
|
| Length |
|
17 mm
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Seated Height-Max |
|
1.8 mm
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Pitch |
|
1 mm
|
| Width |
|
17 mm
|
|
|
|
Compare BCM5400 with alternatives
Compare VSC8552XKS-04 with alternatives