BC860CT/R
vs
BC860C/T3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SOT-23
Package Description
PLASTIC PACKAGE-3
SMALL OUTLINE, R-PDSO-G3
Pin Count
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
LOW NOISE
LOW NOISE
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
45 V
45 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
420
420
JEDEC-95 Code
TO-236AB
TO-236AB
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
PNP
PNP
Power Dissipation-Max (Abs)
0.3 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
100 MHz
100 MHz
VCEsat-Max
0.65 V
Base Number Matches
3
1
Date Of Intro
2017-02-01
Moisture Sensitivity Level
1
Compare BC860CT/R with alternatives
Compare BC860C/T3 with alternatives