BC846B,235 vs SBC846BLT3 feature comparison

BC846B,235 NXP Semiconductors

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SBC846BLT3 Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TO-236 SOT-23
Package Description PLASTIC, SMD, 3 PIN CASE 318-08, TO-236, 3 PIN
Pin Count 3 3
Manufacturer Package Code SOT23 CASE 318-08
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8541.21.00.95
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 65 V 65 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 200 200
JEDEC-95 Code TO-236AB TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e0
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.5 W
Qualification Status Not Qualified COMMERCIAL
Surface Mount YES YES
Terminal Finish TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 100 MHz
VCEsat-Max 0.6 V
Base Number Matches 2 2
Pbfree Code No

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